Windows CE 6.0 R3 Unified Reference Board Support Package for Texas Instruments Sitara AM35x and OMAP35x Cortex-A8 processors |
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As the preferring partner of Texas Instruments (TI), Adeneo Embedded created a unified support of both AM35x and OMAP35x platform ensuring embedded device makers a smooth transition between the two architectures.
Reference BSP for TI Sitara AM35x MPUs - Overview |
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 This board support package (BSP) based on the Windows CE 6.0 R3 kernel and supporting advanced Sitara AM35x features including 3D graphics acceleration, address embedded device makers needs for industrial applications like:
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Unified BSP Architecture The architecture of the unified reference BSP for TI Sitara AM35x and OMAP35x processors is fully compliant with Microsoft PQOAL (Production-Quality OEM Adaptation Layer) and PQD (Production Quality Device) specifications to provide clear separations between CPU-dependent and board-dependent features. This Adeneo Embedded's approach allows embedded device makers: - Focusing only on portions of code they need to adapt when creating their custom design
- Reusing all code linked to the core CPU without modifications
- Securing adaptability, maintenance of the TI OMAP35x and AM35x BSPs
- Smooth migration between OMAP and Sitara architectures
If you need more technical information, please contact our sales team
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Availability/Conditions BSP source code available soon
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Special Discounts for your Registered Unified BSP Customers registering to download the BSP can benefit from one of exclusive discounts on Adeneo Embedded support, training, and engineering services: - Free Getting Started Support
- Discounted Training Class
- Discounted Design Consultation
- Discounted Support Contracts
As a member of the Windows Embedded Design Acceleration Program with Texas Instruments, we offer similar discounts for customers having registered an unified BSP for TI AM35x/OMAP35x. Click here to get more details on this program and discounts offered |
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Register to download the BSP for free and activate the same special incentives as the ones of the Windows Embedded Design Acceleration Program
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