Release of the WinCE 6.0 SDK for TI Cortex-A8 Solutions with our Updated Unified BSP

June 7 2011

Texas Instruments released two weeks ago an updated version of their Windows Embedded CE 6.0 R3 software development kit (SDK) for OMAP35x, AM35x and AM/DM37x processors including our unified board support package (BSP) with new features.

This SDK includes our updated unified BSP that has the following improvements:

Support for BinFS and multiple bin. This feature helps in reducing the boot-up time;

Ability to change the CPU frequency from eboot;

BSP Bug fixes – see BSP release notes for details.

This Windows Embedded CE 6.0 SDK is available for free from the Texas Instruments' website