Release of the WinCE 6.0 SDK for TI Cortex-A8 Solutions with our Updated Unified BSP 
June 7 2011
Texas Instruments released two weeks ago an updated version of their Windows Embedded CE 6.0 R3 software development kit (SDK) for OMAP35x, AM35x and AM/DM37x processors including our unified board support package (BSP) with new features.
This SDK includes our updated unified BSP that has the following improvements:
- Support for BinFS and multiple bin. This feature helps in reducing the boot-up time;
- Ability to change the CPU frequency from eboot;
- BSP Bug fixes – see BSP release notes for details.
This Windows Embedded CE 6.0 SDK is available for free from the Texas Instruments' website
